Abstract
In this paper, an analytical solution is presented for a shaft-loaded blister test for a thin film-substrate system. Both bending and stretching modes of deformation of the film are considered in the model. It is suggested that film-substrate delaminati on behavior under a Mode I separation load is governed by a parameter that relates the membrane stress to the rigidity of the film. The delamination behavior of several model thin film-substrate systems under repeated mechanical loads is studied. It is suggested from the results that film-substrate delamination under cyclic load depends on film rigidity, loading frequency, and film-substrate interfacial characteristics.
Keywords:
blister test, blistering, deformation, delamination, film-substrate system
Paper ID: CTR2310015
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Author Liao K, Wan KT
Title Evaluation of Film-Substrate Interface Durability Using a Shaft-Loaded Blister Test
Symposium ,
Committee D30 on Composite Materials
